On June 7, Beijing Capital Science and Technology Development Group Co., Ltd. completed the bookkeeping issuance of technology innovation corporate bonds (Phase I)  on the Shanghai Stock Exchange, publicly issuing to professional investors.

The bonds raised a total of 100 million yuan, with the term of 3+2 years and the coupon rate of 2.49%, setting a record low interest rate in the history of Beijing technology innovation corporate bonds with the same rating level and maturity period. Everbright Securities acted as the sole main underwriter of the bond, and ZGC Sci-tech Guarantee, a member of the group, provided a guarantee.

Before this issuance, ZGC Sci-tech Guarantee Company supported the Capital Science and Technology Development Group to successfully issue 300 million yuan of technology innovation corporate bonds in 2022. With recognition and support from various investment institutions such as banks, funds and securities brokerages, the bond’s subscription ratio reached 2.4 times.

It is reported that the funds raised by those bonds are mainly used to support scientific and technological innovation. Among them, equity investments will mainly flow into biomedicine, new materials, new generation of information technology and other fields, using new quality productivity to guide the high-quality development of technology innovation enterprises.