Zhongke Tongzhi Semiconductor (Jiangsu) co., Ltd., a supplier of key packaging equipment for semiconductor manufacturing, announced the completion of the pre-A round of financing, with ZGC Collaborative Innovation Funds exclusively investing in tens of millions of yuan, which is mainly used to improve the production capacity and performance of semiconductor vacuum furnaces and high-precision mount machines.

After years of R&D, production and innovation, Zhongke Tongzhi has achieved mass sales of vacuum furnaces in the fields of laser and infrared, with products sold to 18 listed companies, nearly 100 large-scale enterprises and military research institutions.

ZGC Collaborative Innovation Funds has a total of 12 funds. This round of pre-A investment was led by Taixing ZGC Collaborative Innovation Fund, an industrial organization fund co-established by ZGC Collaborative Innovation Fund and Jiangsu Taixing, also an important practice to strengthen the cooperation between Beijing-Tianjin-Hebei region and the Yangtze River Delta Economic Belt.